Printed circuit board with tin pads

Details Printed circuit board with tin pads Printed circuit board with tin pads

2008-09-15

2011-12-13

Pape, Zachary M (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S257000, C174S263000, C174S266000

Reexamination Certificate

active

08077472

ABSTRACT:
A printed circuit board of the present disclosure includes a main body, a tin layer, and a solder mask. The main body defines a through hole configured for being connected to a grounding component. The tin layer is formed on a surface of the main body around the through hole. The tin layer contacts the grounding component. The solder mask is formed between a periphery of the through hole and the tin layer. The solder mask is configured to prevent tin cream of the tin layer from flowing into the through hole.

REFERENCES:
patent: 4851614 (1989-07-01), Duncan, Jr.
patent: 5326937 (1994-07-01), Watanabe
patent: 5414223 (1995-05-01), Suski et al.
patent: 5420378 (1995-05-01), Estes et al.
patent: 5545223 (1996-08-01), Neuenfeldt et al.
patent: 5668699 (1997-09-01), Bell et al.
patent: 6295210 (2001-09-01), Lanzone et al.
patent: 7898820 (2011-03-01), Kao et al.
patent: 2009/0200074 (2009-08-01), Douriet et al.
patent: 1155369 (1997-07-01), None
patent: 201197221 (2009-02-01), None
patent: 2000-4088 (2000-01-01), None

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