Printed circuit board with through-holes including a test land h

Details Printed circuit board with through-holes including a test land h Printed circuit board with through-holes including a test land h

1991-04-09

1993-11-30

Strecker, Gerard R.

Electricity: measuring and testing

Impedance, admittance or other quantities representative of...

Lumped type parameters

324158R, 324537, 324713, G01R 2708, G01R 3102

Patent

active

052669041

ABSTRACT:
A printed circuit board having through-holes and a test land for testing the through-holes. The test land is composed of a pair of current measurement lands and a pair of resistance measurement lands in order to test accurately the packing conditions of the conductive paste packed in the through-holes, thereby improving the uniformity and completeness of conductive-paste packing in printed circuit boards.

REFERENCES:
patent: 3766470 (1973-10-01), Hay et al.
patent: 3781683 (1973-12-01), Freed
patent: 4245189 (1981-01-01), Wahl et al.
patent: 4675600 (1987-06-01), Gergin

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