Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2009-02-27
2011-10-18
Prasad, Chandrika (Department: 2839)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
Reexamination Certificate
active
08039761
ABSTRACT:
Disclosed is a printed circuit board having a flow preventing dam and a manufacturing method thereof. The printed circuit board includes a base substrate having a solder pad, a solder bump formed on the solder pad of the base substrate, and a flow preventing dam formed on a peripheral area of the base substrate using a dry film resist. The flow preventing dam can prevent the outflow of an underfill solution and can be simply formed.
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Korean Office Action mailed Jul. 28, 2010 and issued in corresponding Korean Patent Application No. 10-2008-0112362 (Reference BA) cited U.S. Published Patent No. 6,853,089 and Korean Patent Registration No. 10-0691443 (References AA and AG).
Korean Office Action mailed Jul. 28, 2010 and issued in corresponding Korean Patent Application No. 10-2008-0112362.
Choi Jin Won
Kim Seung Wan
Prasad Chandrika
Samsung Electro-Mechanics Co. Ltd.
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