Printed circuit board with locally enhanced wiring density

Details Printed circuit board with locally enhanced wiring density Printed circuit board with locally enhanced wiring density

1993-11-17

1995-03-28

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174251, 174262, 174264, 361777, H05K 100

Patent

active

054019095

ABSTRACT:
A printed circuit board and a method for making same is disclosed whereby a very high wiring density is provided in those regions of the printed circuit board in which external components (e.g., semiconductor chips) are to be attached directly. An automated registration routine permits very precise registration and positioning in those regions.

REFERENCES:
patent: 5110664 (1992-05-01), Nakanishi et al.
patent: 5272645 (1993-12-01), Kawakami et al.

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