Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2006-10-10
2006-10-10
Cureo, Kamand (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C062S259200, C165S080500
Reexamination Certificate
active
07119284
ABSTRACT:
Printed circuit board with insulated metal substrate with integrated cooling systemlt comprises a metal substrate (10), at least one electrically insulating layer (11) adhered to said metal substrate (10) and several electro-conducting tracks (12) capable of interconnecting electronic power components (24), adhered to said electrically insulating layer (11), said metal substrate (10) incorporating several heat transporting channels comprising several conduits for a heat-carrying fluid, conduits which extend to the outside of the metal substrate up to a heat transfer area to an outside medium.
REFERENCES:
patent: 5875097 (1999-02-01), Amaro et al.
patent: 5929518 (1999-07-01), Schlaiss
patent: 6032355 (2000-03-01), Tseng et al.
patent: 6158232 (2000-12-01), Tsuji et al.
patent: 6190941 (2001-02-01), Heinz et al.
patent: 6201300 (2001-03-01), Tseng et al.
patent: 6201701 (2001-03-01), Linden et al.
patent: 6212071 (2001-04-01), Roessler et al.
patent: 6219246 (2001-04-01), Edevold et al.
patent: 6226178 (2001-05-01), Border et al.
Bel Caŕles Borrego
Foguet Xavier Sanchez
Sole Alex Subirates
Carpio Ivan
Cureo Kamand
Harang Bruce E.
Lear Corporation
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