Printed circuit board with isolated metallic substrate...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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C062S259200, C165S080500

Reexamination Certificate

active

07119284

ABSTRACT:
Printed circuit board with insulated metal substrate with integrated cooling systemlt comprises a metal substrate (10), at least one electrically insulating layer (11) adhered to said metal substrate (10) and several electro-conducting tracks (12) capable of interconnecting electronic power components (24), adhered to said electrically insulating layer (11), said metal substrate (10) incorporating several heat transporting channels comprising several conduits for a heat-carrying fluid, conduits which extend to the outside of the metal substrate up to a heat transfer area to an outside medium.

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patent: 5929518 (1999-07-01), Schlaiss
patent: 6032355 (2000-03-01), Tseng et al.
patent: 6158232 (2000-12-01), Tsuji et al.
patent: 6190941 (2001-02-01), Heinz et al.
patent: 6201300 (2001-03-01), Tseng et al.
patent: 6201701 (2001-03-01), Linden et al.
patent: 6212071 (2001-04-01), Roessler et al.
patent: 6219246 (2001-04-01), Edevold et al.
patent: 6226178 (2001-05-01), Border et al.

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