Printed circuit board with integrated heat sink

Details Printed circuit board with integrated heat sink Printed circuit board with integrated heat sink

1998-10-26

2000-02-29

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361719, 361720, 361704, 361709, 361712, 361713, 165 802, 165185, 174 163, 174252, H05K 346

Patent

active

060317272

ABSTRACT:
According to the present invention, functional heat conducting planar layers within a printed circuit board (PCB) are corrugated to allow for enhanced heat dissipation. According to a preferred embodiment, at least one of the power and ground planes is at least partially corrugated to extract heat from the PCB. By corrugating heat conducting structures within the PCB, additional heat dissipating surface area is provided for the PCB without the need to provide any additional heat dissipating structure.

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patent: 5830311 (1998-11-01), Braun et al.

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