Printed circuit board with integrated cooling mechanism

Details Printed circuit board with integrated cooling mechanism Printed circuit board with integrated cooling mechanism

1998-12-18

2000-08-08

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361719, 361721, 361757, 361784, 361799, 257706, 257709, 257713, 165185, 174 163, H05K 720

Patent

active

061010944

ABSTRACT:
An electronic device having two or more printed circuit boards with integrated heat-dissipating mechanism without a fan. A heat-generating circuit component is placed on a daughter board separated from a motherboard. An electrically insulating thermal conductor is placed between the daughter board and the motherboard for heat transfer.

REFERENCES:
patent: 3157828 (1964-11-01), Flaherty
patent: 5390078 (1995-02-01), Taylor

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