Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-05-05
1995-12-05
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 803, 257707, 361707, H05K 720
Patent
active
054735114
ABSTRACT:
A printed wiring board having electronic circuit devices (13, 44) such as semiconductors including a heat sink forming a housing (32, 36) for the printed wiring board, one of the electronic devices (13) being mounted on one portion (12) of a heat spreader that is formed of a material having high thermal conductivity, another portion (10) of the heat spreader forming a thermal energy flow path to the heat sink, thereby lowering the junction temperature at the electronic device (13) and increasing the reliability of the wiring board.
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"Thermally Enhanced Multilayer Ceramic Substrate Structure", Q. K. Kerjilian et al, IBM Technical Disclosure Bulletin, vol. 18, No. 2, Jul. 1975. pp. 353-354.
Baker Jay D.
Reddy Prathap A.
Salisbury Kenneth A.
Ford Motor Company
May Roger L.
Mierzwa Kevin G.
Tolin Gerald P.
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