Printed circuit board with high electronic component density

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

361749, 361761, 361803, 257686, 257723, 257777, H05K 706

Patent

active

060847808

DESCRIPTION:

BRIEF SUMMARY
TECHNICAL FIELD

The present invention relates to a printed-circuit board mounted with a number of electronic components, and to an electronic apparatus provided with the printed circuit board.


BACKGROUND ART

In recent years, printed-circuit boards each comprising a printed-wiring board and a number of electronic components mounted on the board are used in increasing numbers, in electronic apparatuses such as personal computers. Generally, a printed-wiring board has a conductor pattern including a number of connection pads. Electronic components are mounted on the printed-wiring board, with their connection terminals soldered to the connection pads.
Recently, electronic apparatuses are made smaller and designed to have better performance. Printed-circuit boards for use in these apparatuses must therefore be small and must acquire high performance.
The smaller a printed-circuit board, the smaller its area. Nonetheless, more electronic components must be mounted to achieve higher performance. There is a limit to the density at which electronic components can be mounted. Thus it is difficult, in some cases, to mount all required components on the printed-wiring board. If so, it is impossible to miniaturize the printed-circuit board any more.


DISCLOSURE OF THE INVENTION

The present invention has been made in view of the foregoing, and its object is to provide a printed-circuit board which has electronic components mounted at a high density and which is smaller than conventional ones, and to provide an electronic apparatus provided with the same.
To attain the object mentioned above, a printed-circuit board according to the invention comprises: a main printed-wiring board having a first conductor pattern; a first electronic component mounted on the main printed-wiring board and electrically connected to the first conductor pattern; an auxiliary printed-wiring board mounted on the main printed-wiring board, covering the first electronic component, and having a second conductor pattern electrically connected to the first conductor pattern; and a second electronic component mounted on the auxiliary printed-wiring board and electrically connected to the second conductor pattern.
A printed-circuit board according to the invention comprises: a main printed-wiring board having a first conductor pattern; a first electronic component mounted on the main printed-wiring board and electrically connected to the first conductor pattern; and a component unit including an auxiliary printed-wiring board having a second conductor pattern, and a second electronic component mounted on the auxiliary printed-wiring board and electrically connected to the second conductor pattern. The component unit is mounted on the main printed-wiring board, covering the first electronic component, and the second conductor pattern is electrically connected to the first conductor pattern.
As described above, the auxiliary printed-wiring board on which the second electronic component is arranged, covering the first electronic component. The first and second electronic components are thus mounted in three-dimensional fashion. Hence, many electronic components can be mounted at a high density.
Moreover, an electronic apparatus according to the present invention comprises: a housing; input means provided on the housing, for inputting information; display means provided on the housing, for displaying information; and a printed-circuit board arranged in the housing. The printed-circuit board includes: a main printed-wiring board having a first conductor pattern; a first electronic component mounted on the main printed-wiring board and electrically connected to the first conductor pattern; an auxiliary printed-wiring board mounted on the main printed-wiring board, covering the first electronic component, and having a second conductor pattern electrically connected to the first conductor pattern; and a second electronic component mounted on the auxiliary printed-wiring board and electrically connected to the second conductor patterns.


BRIEF DESCRIPT

REFERENCES:
patent: 4982265 (1991-01-01), Watanabe et al.
patent: 5061990 (1991-10-01), Arakawa et al.
patent: 5290971 (1994-03-01), Hamaguchi et al.
patent: 5307241 (1994-04-01), Pistilli
patent: 5334875 (1994-08-01), Sugano et al.
patent: 5434745 (1995-07-01), Shokrgozar et al.
patent: 5438224 (1995-08-01), Papageorge et al.
patent: 5455741 (1995-10-01), Wai et al.
patent: 5471368 (1995-11-01), Downie et al.
patent: 5579207 (1996-11-01), Hayden et al.
patent: 5770300 (1998-06-01), Okamoto et al.
IBM Technical Disclosure Bulletin Dual-In-Line Package Socket "Piggyback" Stucture by McAtee vol. 16 No. 4, Sep. 1973.
2244 Research Disclosure, 31707 "Jumper for Dual Inline Packaged (DIP) Integrated Circuits," No. 317, Emsworth, GB, Sep. 1990.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Printed circuit board with high electronic component density does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circuit board with high electronic component density, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board with high electronic component density will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1492218

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.