Printed circuit board with embedded cavity capacitor

Details Printed circuit board with embedded cavity capacitor Printed circuit board with embedded cavity capacitor

2011-07-19

2011-07-19

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S761000, C361S762000, C257S296000, C257S301000

Reexamination Certificate

active

07983055

ABSTRACT:
A printed circuit board having an embedded cavity capacitor is disclosed. According to an embodiment of the present invention, the printed circuit board having the embedded cavity capacitor, the printed circuit board can include two conductive layers to be used as a power layer and a ground layer, respectively; and a first dielectric layer, placed between the two conductive layers, wherein at least one cavity capacitor is arranged in a noise-transferable path between a noise source and a noise prevented destination which are placed on the printed circuit board, the cavity capacitor being formed to allow a second dielectric layer to have a lower stepped region than the first dielectric layer, the second dielectric layer using the two conductive layers as a first electrode and a second electrode, respectively, and placed between the first electrode and the second electrode.

REFERENCES:
patent: 6344413 (2002-02-01), Zurcher et al.
patent: 6734483 (2004-05-01), Morand et al.
patent: 6784519 (2004-08-01), Iwamoto et al.
patent: 6992344 (2006-01-01), Coolbaugh et al.
patent: 7456459 (2008-11-01), Wan
patent: 2001-0057047 (2001-07-01), None
patent: 10-0337947 (2002-05-01), None
Office Action mailed on Jul. 22, 2008 and issued in corresponding Korean Patent Application No. 10-2007-0097720.

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