Printed circuit board with embedded capacitors therein and...

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Including isolation structure

Reexamination Certificate

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Details

C438S393000, C257SE21008, C257SE21350, C029S832000

Reexamination Certificate

active

07378326

ABSTRACT:
A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates formed on the second circuit layers; blind via-holes and through-holes formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes and the through-holes. The manufacturing method of the printed circuit board is also disclosed.

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patent: 5501350 (1996-03-01), Yoshida et al.
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patent: 6274224 (2001-08-01), O'Bryan et al.
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patent: 2004/0118600 (2004-06-01), Lee et al.
patent: 2005/0100719 (2005-05-01), Kanakarajan et al.
patent: 2005/0208754 (2005-09-01), Kostamo et al.
patent: 2006/0143886 (2006-07-01), Srinivasan et al.
patent: 2006/0203421 (2006-09-01), Morris et al.
patent: 2002-367858 (2002-12-01), None
patent: 2004-0060443 (2004-07-01), None

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