Printed circuit board with electronic devices mounted thereon

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361689, 361698, 361704, 361719, 361720, 174 151, 165 804, H05K 720

Patent

active

060522844

ABSTRACT:
A cooler-equipped printed circuit board, in which electronic devices arranged in a matrix form on the printed circuit board are covered with a sealed case held in liquidtight contact with the board and having a coolant channel from an inlet port and an outlet port made in the case. Barriers are provided in the coolant channel to change the direction of flow of the coolant to stir it and make its temperature uniform throughout it.

REFERENCES:
patent: 4531176 (1985-07-01), Beecher et al.
patent: 5021924 (1991-06-01), Kieda et al.
patent: 5270572 (1993-12-01), Nakajima et al.
patent: 5323292 (1994-06-01), Brzezinski
patent: 5448108 (1995-09-01), Quon et al.
patent: 5574627 (1996-11-01), Porter
patent: 5774334 (1998-06-01), Kawamura et al.
patent: 5841634 (1998-11-01), Visser
"Heat Transfer in a Liquid Cooling System" Cohen et al. IBM Technical Disclosure Bulletin, vol. 11, No. 6, Nov. 1968.
"High -Power Electronic Package" D. J. Crawford IBM Technical Disclosure Bulletin, vol. 20, No. 11A, Apr. 1978.
"Cold Plate for Thermal Conduction Module with Reduced Water Flow Resistance< Increased Fin Area< and Improved Water Turbulence" IBM Technical Disclosure Bulletin, vol. 29, No. 2, Jul. 1986.

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