Thermal measuring and testing – Temperature measurement – Combined with diverse art device
Patent
1993-05-03
1994-01-25
Cuchlinski, Jr., William A.
Thermal measuring and testing
Temperature measurement
Combined with diverse art device
374183, 361384, 361694, 73756, G01K 1300
Patent
active
052810267
ABSTRACT:
A monitoring system for printed circuit boards which are air-cooled utilizes temperature sensors which have thermal diodes embedded directly into the integrated circuits. The thermal diodes are part of the fully-functioning integrated circuit which utilize voltages on the board for driving so that no added power sources are required. The thermal diode has a voltage which is inversely proportional to the temperature and can be calibrated so that a given voltage can be converted into a given temperature. This can be utilized by a logic controller to monitor and control cooling. Pressure sensors are also used with the temperature sensors to monitor air pressure along the ducts leading to the printed circuit boards. Pressure sensors also utilize voltages from the board for driving and have an amplification circuit to increase the signal. The pressure reading can also be utilized by a logic controller for controlling and monitoring the cooling of the boards.
REFERENCES:
patent: 3141999 (1964-07-01), Schneider
patent: 3198991 (1965-08-01), Barnett
patent: 3420104 (1969-01-01), Troemel et al.
patent: 3527989 (1970-09-01), Cuzner et al.
patent: 3737728 (1973-06-01), Austin
patent: 3741292 (1973-06-01), Askalu et al.
patent: 3812717 (1974-05-01), Miller et al.
patent: 3851221 (1974-11-01), Beaulieu et al.
patent: 3996451 (1976-12-01), Harrington et al.
patent: 3999105 (1976-12-01), Archey et al.
patent: 4047435 (1977-09-01), Keith
patent: 4050083 (1977-09-01), Jaskolski et al.
patent: 4104700 (1978-08-01), Hutchinson et al.
patent: 4185253 (1980-01-01), Lade et al.
patent: 4204247 (1980-05-01), Wigley
patent: 4262532 (1981-04-01), Butler et al.
patent: 4283754 (1981-08-01), Parks
patent: 4450472 (1984-05-01), Tuckerman et al.
patent: 4535385 (1985-08-01), August et al.
patent: 4536824 (1985-08-01), Barrett et al.
patent: 4567428 (1986-01-01), Zbinden
patent: 4628407 (1986-12-01), August et al.
patent: 4758926 (1988-07-01), Herrell et al.
patent: 4854731 (1989-08-01), Jenkins
patent: 5024263 (1991-06-01), Laine et al.
patent: 5024535 (1991-06-01), Winston, Jr.
patent: 5230564 (1993-07-01), Bartilson et al.
"High-Performance Heat Sinking for VLSI," Tuckerman et al., IEEE Electron Device Letters, vol. EDL-2, No. 5, pp. 126-129, May 1981.
"Heat Transfer From Pin-Fins Situated in an Oncoming Longitudinal Flow Which Turns to Crossflow," Sparrow et al., Int. J. Heat Mass Transfer, vol. 25, No. 5, pp. 603-614, 1982.
"Performance Comparisons Among Geometrically Different Pin-Fin Arrays Situated in an Oncoming Longitudinal Flow," Larson et al., Int. J. Heat Mass Transfer, vol. 25, No. 5, pp. 723-725, 1982.
"Heat Transfer With Impinging Jets," R. Goldstein, Proceedings of the Symposium on Nonlinear Problems in Energy Engineering, Argon National Labs, pp. 7-15, 1983.
"Local Heat Transfer to Staggered Arrays of Impinging Circular Air Jets," Behbahani et al., Transactions of the ASME, vol. 105, pp. 354-359, 1983. (no month).
"Heat-Transfer Microstructures for Integrated Circuits," D. Tuckerman, Stanford University, pp. 1-141, Feb. 1984.
"Heat Transfer in Forced Convection Through Fins," R. Keyes, IEEE Transactions on Electron Devices, vol. ED-31, No. 9, pp. 1218-1221, Sep. 1984.
"IBM Packs in High Density Circuits" Computer Design, No. 14, pp. 254-255, Dec. 1984.
"Effect of Inlet, Exit, and Fin Geometry on Pin Fins Situated in a Turning Flow," Sparrow et al., pp. 1039-1053, 1984. (no month).
"Experimental Investigation of Multi-Jet Impingement Cooling of an Array of Microelectronic Heat Sources," Jiji et al., The City College of the City University of New York, pp. 1-31, Aug. 1986.
"Thermal Impact of Double-Sided Printed Circuit Cards," T. Davis, IBM Systems Technology Division, pp. 11-15, 1987. (no month).
"Forced-Convection, Liquid-Cooled, Microchannel Heat Sinks for High-Power-Density Microelectronics," Phillips et al., pp. 295-318, Jan. 1988.
"Impingement Cooling of Electronics," Hollworth et al., Alfred University, HTD-vol. 111, pp. 89-96, 1989. (no month).
"Air Jet Impingement Cooling of an Array of Simulated Electronics Packages," T. Hamadah, HTD-vol. 111, pp. 97-105, 1989. (no month).
"Impingement Cooling of a Simulated Electronics Package with a Square Array of Round Air Jets," T. Hamadah, HTD-vol. 111, pp. 107-112, 1989. (no month).
"Local Heat Transfer Coefficients Under an Axisymmetric, Single-Phase Liquid Jet," Stevens et al., HTD-vol. 111, pp. 113-119, 1989. (no month).
"Jet Impingement Flow Boiling of a Mixture of FC-72 and FC-87 Liquids on a Simulated Electronic Chip," Nonn et al., HTD-vol. 111, pp. 121-128, 1989. (no month).
"Thermal Performance Characteristics of Air-Cooled Cold Plates for Electronic Cooling," Yimer et al., HTD-vol. 111, pp. 143-148, 1989. (no month).
"Flow Visualization in an Impinging Circular Air Jet," Behbahani et al., HTD-vol. 112, pp. 143-148, 1989. (no month).
"Prediction of Surface Temperature and Heat Flux of a Microelectronic Chip With Jet Impingement Cooling," Wang et al., Journal of Electronic Packaging, vol. 112, pp. 57-62, Mar. 1990.
"On the Accommodation of Coolant Flow Paths in High-Density Packaging," W. Nakayama, InterSociety Conference on Thermal Phenomena, pp. 101-112, 1990. (no month).
"Impingement Cooling of Electronics: Effects of Venting Through Circuit Board," Hollworth et al., Alfred University, pp. 80-96, date unknown.
Bartilson Bradley W.
Schlimme Elliot F.
Bennett G. Bradley
Cray Research Inc.
Cuchlinski Jr. William A.
LandOfFree
Printed circuit board with cooling monitoring system does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed circuit board with cooling monitoring system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board with cooling monitoring system will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-723738