Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-08-29
2006-08-29
Thai, Luan (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S707000, C257S708000, C257SE31131, C257SE23051, C257S691000
Reexamination Certificate
active
07098533
ABSTRACT:
A printed circuit board (PCB) with a heat dissipation element, a method for manufacturing the PCB, and a semiconductor package using the PCB dissipates heat generated from the semiconductor chip and reduces a printed circuit board height. The PCB includes a heat sink panel, an alloy panel attached to one surface of the heat sink panel serving to ground and to dissipate heat, a circuit pattern layer having via holes formed on one surface of the alloy panel and electrically coupled to the alloy panel, and a cavity formed by perforating the circuit pattern layer and the alloy panel. A semiconductor chip is on the heat sink panel in the cavity and electrically coupled to the circuit pattern layer. The alloy panels with the circuit patterns can be manufactured in pairs with an insulation carrier therebetween. A plurality of dissipation protrusions can be formed on the surface of the alloy panel or the surface of the heat sink panel to couple the same.
REFERENCES:
patent: 5158912 (1992-10-01), Kellerman et al.
patent: 5633533 (1997-05-01), Andros et al.
patent: 5831825 (1998-11-01), Fromont
patent: 5844168 (1998-12-01), Schueller et al.
patent: 5858816 (1999-01-01), Sato et al.
patent: 6020637 (2000-02-01), Karnezos
patent: 6097089 (2000-08-01), Gaku et al.
patent: 6184580 (2001-02-01), Lin
patent: 6395582 (2002-05-01), Sohn et al.
patent: 6856011 (2005-02-01), Choi
Kim Yong Il
Lee Sung Gue
Fleshner & Kim LLP
Thai Luan
LandOfFree
Printed circuit board with a heat dissipation element and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed circuit board with a heat dissipation element and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board with a heat dissipation element and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3643937