Printed circuit board with a heat dissipation device

Details Printed circuit board with a heat dissipation device Printed circuit board with a heat dissipation device

2007-08-07

2007-08-07

Zarroli, Michael C. (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S689000, C361S719000

Reexamination Certificate

active

11265367

ABSTRACT:
An electronic assembly includes a printed circuit aboard, a CPU, an electronic component and a thermal pad attached to the printed circuit board. The CPU and the electronic component are located on a first face of the printed circuit board. The electronic component is located near the CPU. The thermal pad is attached to a second face opposite to the first face of the printed circuit board and located just below the electronic component.

REFERENCES:
patent: 5459639 (1995-10-01), Izumi
patent: 6000125 (1999-12-01), Kang
patent: 6710691 (2004-03-01), Yu et al.
patent: 6750084 (2004-06-01), Delheimer
patent: 6917523 (2005-07-01), Summers et al.
patent: 7038910 (2006-05-01), Hodge et al.
patent: 2621311 (2004-06-01), None
patent: 2682473 (2005-03-01), None
patent: 2000332171 (2000-11-01), None

Affiliated with

Also associated with

Rating

Printed circuit board with a heat dissipation device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circuit board with a heat dissipation device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board with a heat dissipation device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3858159