Printed circuit board with a coverlay film

Details Printed circuit board with a coverlay film Printed circuit board with a coverlay film

1994-06-30

1995-12-05

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174250, 174259, H05K 100

Patent

active

054731186

ABSTRACT:
A printed circuit board assembly having a coverlay film which is a composite film consisting of a porous fluoropolymer film coated with a thermoplastic or heat-curing adhesive is disclosed. The coverlay film has excellent conformability and adhesion to the printed circuit board and low dielectric constant.

REFERENCES:
patent: 5034801 (1991-07-01), Fischer
patent: 5089346 (1992-02-01), Imaizumi et al.
patent: 5171826 (1992-12-01), Imaizumi et al.
patent: 5234522 (1993-08-01), Suzuki et al.
patent: 5260130 (1993-11-01), Sakaguchi et al.

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