Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate
2007-02-06
2007-02-06
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
Process
Preplacing solid filler
C228S223000
Reexamination Certificate
active
10748868
ABSTRACT:
A printed circuit board that can be connected with a pin connector and a method of manufacturing the printed circuit board are provided. Solidified solder can be formed on the tap unit without the need for additional processes, by applying solder printing to the tap unit at the same time it is applied to pads of the printed circuit board and, for example, by performing high temperature reflow. In addition, reliability and reduction in cost of a pin connector can be ensured without using a pin connector into which a high-priced wired solder is inserted. Rather a general pin connector can be used because the pin connector and the tap unit are connected to each other through the solidified solder formed on the tap unit.
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English language of Abstract for Japanese patent publication No. JP2001-23738, published on Jan. 10, 2001.
English language abstract of Japanese Publication No. JP4155990, no date avail.
Choi Jong-Soo
Kim Byung-Man
Lee Joung-Rhang
Park Chang-Yong
Beveridge Rachel E.
Johnson Jonathan
Marger & Johnson & McCollom, P.C.
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