Printed circuit board that provides improved thermal dissipation

Details Printed circuit board that provides improved thermal dissipation Printed circuit board that provides improved thermal dissipation

1997-11-06

1999-11-09

Powell, William

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

216 20, 361707, 361719, 361764, H05K 710

Patent

active

059826304

ABSTRACT:
A printed circuit board to support an integrated circuit and provide thermal dissipation. A layer of thermally conductive material is disposed between lower and upper dielectric layers. Above this structure is disposed another layer of thermally conductive material to be thermally coupled to an integrated circuit. A thermal via couples the two layers of thermally conductive material to each other.

REFERENCES:
patent: 5332869 (1994-07-01), Hagiwara
patent: 5746927 (1998-05-01), Hashimoto et al.

Affiliated with

Also associated with

Rating

Printed circuit board that provides improved thermal dissipation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circuit board that provides improved thermal dissipation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board that provides improved thermal dissipation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1464950