Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1983-10-18
1985-04-23
Ramsey, Kenneth J.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
228 43, 228259, 2281801, 198342, 118423, H05K 334
Patent
active
045125104
ABSTRACT:
Carriers each carrying a printed circuit board is conveyed successively through a soldering zone to dip each printed circuit board in molten solder contained in a vessel disposed below a space defined by two pairs of parallel front and rear rails. The four rails are engageable with four wheels of the carrier simultaneously and are vertically moveable so the printed circuit board carried on the carrier on the rails are contacted with the molten solder when the rails are in their lowered positions. Engaging means is provided for movement with one of the rails and for supporting engagement with the carrier. The engaging means is horizontally moveable so that the carrier engaged by the engaging means is horizontally moved forward and backward. By suitably moving the rails and the engaging means, the printed circuit board may alight on and leave from the surface of the molten solder in any desired tilted state.
REFERENCES:
patent: 3828419 (1974-08-01), Wanner
patent: 4090654 (1978-05-01), Volkert
patent: 4284225 (1981-08-01), Hess
patent: 4285457 (1981-08-01), Kondo
patent: 4311265 (1982-01-01), Kondo
patent: 4311266 (1982-01-01), Kondo
Jordan M.
Nihon Den-Nitsu Keiki Co. Ltd.
Ramsey Kenneth J.
Yee Stephen F. K.
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