Metal fusion bonding – Process – Plural joints
Patent
1981-01-21
1982-11-23
Smith, John D.
Metal fusion bonding
Process
Plural joints
228224, 228250, 427 96, 427312, 29840, 148 23, B05D 512, B23K 3102
Patent
active
043601448
ABSTRACT:
The present invention relates to a method of wave soldering an assembly composed of a plurality of electrical conductors disposed on a surface of a sheet of insulating material. In accordance with this method, the surface of the sheet and the conductors are contacted with a stationary wave of molten solder having a polyether admixed therewith and floating on the surface thereof. The polyether is a heteric or block copolymer of a dihydroxyphenol and at least one lower alkylene oxide. It is preferred that the alkylene oxide contain 2 to 4 carbon atoms. The alkylene oxide may be all ethylene oxide or may be a mixture with other lower alkylene oxides such as propylene oxides and butylene oxides. In any event, the copolymer should contain at least about 20 percent by weight of oxyethylene groups, balance oxypropylene groups and/or oxybutylene groups. A conventional polymeric oxidation inhibitor may also be included.
REFERENCES:
patent: 3627696 (1971-12-01), Heithaus et al.
patent: 3755886 (1973-09-01), Hermann
patent: 4094797 (1978-06-01), Newkirk et al.
patent: 4127692 (1978-11-01), Boynton
patent: 4140554 (1979-02-01), Stayner et al.
Cuddy William A.
Eisenstein Stephen E.
Thir Basil
BASF Wyandotte Corporation
Plantz Bernard F.
Smith John D.
Swick Bernhard R.
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