Printed circuit board reinforcement structure and integrated...

Electricity: electrical systems and devices – Igniting systems – For electric spark ignition

Reexamination Certificate

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C174S260000

Reexamination Certificate

active

08059384

ABSTRACT:
A printed circuit board reinforcement structure for a printed circuit board receiving a plurality of surface mounting devices, and an integrated circuit package using the same. The structure includes a hard layer having one or more openings formed at areas corresponding to one or more surface mounting devices with a thickness exceeding a predetermined thickness; and a soft layer bonded to a side of the hard layer so that the soft layer can accommodate the protrusion of the surface mounting devices. The structure prevents defects of a printed circuit board, such as deformation, fracture or the like, while substantially reducing the size of a package by applying a reinforcement structure to a thin printed circuit board, thereby reinforcing the rigidity (mechanical strength) of the thin printed circuit board.

REFERENCES:
patent: 5574309 (1996-11-01), Papapietro et al.
patent: 5822194 (1998-10-01), Horiba et al.
patent: 6506626 (2003-01-01), Chiu
patent: 7038142 (2006-05-01), Abe
patent: 2003/0150641 (2003-08-01), Kinayman et al.
patent: 2006/0139902 (2006-06-01), Happoya
patent: 2006/0171130 (2006-08-01), Konishi et al.
patent: 2007/0044303 (2007-03-01), Yamano
patent: 2009/0107715 (2009-04-01), Sasaoka
patent: 20020032748 (2002-05-01), None
patent: WO0234856 (2002-05-01), None

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