Printed circuit board providing heat dissipation

Details Printed circuit board providing heat dissipation Printed circuit board providing heat dissipation

2011-08-30

2011-08-30

Semenenko, Yuriy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S777000

Reexamination Certificate

active

08008579

ABSTRACT:
A printed circuit board includes an insulated base sheet, a heat-conducting layer, and a plurality of heat-conducting blocks. The heat-conducting layer is disposed on the insulated base sheet. The heat-conducting blocks are formed on the heat-conducting layer. Each of the heat-conducting blocks is separated from each other.

REFERENCES:
patent: 5930117 (1999-07-01), Gengel
patent: 6621705 (2003-09-01), Ballenger et al.
patent: 6930885 (2005-08-01), Barcley
patent: 2004/0216917 (2004-11-01), Amir et al.
patent: 2005/0039944 (2005-02-01), Kim et al.
patent: 2603595 (2004-02-01), None
patent: 2927605 (2007-07-01), None

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