Printed circuit board provided with heat circulating medium...

Details Printed circuit board provided with heat circulating medium... Printed circuit board provided with heat circulating medium...

2007-07-12

2011-10-25

Norris, Jeremy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C174S267000, C029S847000

Reexamination Certificate

active

08044301

ABSTRACT:
A printed circuit board includes a lower plate provided with an internal circuit wiring and having a recessed part at a surface thereof and a plurality of projection patterns at a lower surface of the recessed part; an upper plate having the same structure of the lower plate and adhered to the lower plate so that surfaces formed with the recessed part are opposite to each other; a heat circulation medium injected into an internal space formed by the recessed parts of the lower and upper plates.

REFERENCES:
patent: 5283715 (1994-02-01), Carlsten et al.
patent: 7626260 (2009-12-01), Chung et al.
patent: 2003-329379 (2003-11-01), None
patent: 2007-027466 (2007-02-01), None
patent: 2007-043013 (2007-02-01), None
patent: 1020030087646 (2003-11-01), None
patent: 1020050004134 (2005-01-01), None
patent: 1020050117482 (2005-12-01), None

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