Printed circuit board provided with a higher density of terminal

Details Printed circuit board provided with a higher density of terminal Printed circuit board provided with a higher density of terminal

1991-12-02

1994-03-01

Donovan, Lincoln

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174250, 174254, 174260, 174261, 361749, 361784, H05K 100

Patent

active

052909719

ABSTRACT:
This invention relates to printed circuit boards and a method of fabricating same wherein the input/output terminals are integral with the wiring layer of the printed circuit board. This arrangement allows for a higher density of input/output connections than is possible with conventional printed circuit boards.

REFERENCES:
patent: 3689991 (1972-09-01), Aird
patent: 3746932 (1973-07-01), Hogan et al.
patent: 4410927 (1983-10-01), Butt
patent: 4450029 (1984-05-01), Holbert et al.
patent: 4604677 (1986-08-01), Suzuki et al.
patent: 4949224 (1990-08-01), Yamamura et al.
Lapedes, Daniel N., Dictionary of Scientific and Technical Terms, McGraw-Hill Book Company, NY 1978, pp. 445, 1562.
Larnerd, J. D., McBride, D. G.: IC Package Assemblies, IBM Technical Disclosure Bulletin, vol.21, Oct. 1978, pp. 1817-1818.

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