Printed circuit board process using plasma spraying of conductiv

Details Printed circuit board process using plasma spraying of conductiv Printed circuit board process using plasma spraying of conductiv

1996-10-02

1999-04-06

Bareford, Katherine A.

Coating processes

Spray coating utilizing flame or plasma heat

Nonuniform or patterned coating

427455, 427 96, 427 97, C23C 402

Patent

active

058915281

ABSTRACT:
A printed circuit board is formed by selectively conditioning at least one surface of a substrate with a pattern including selected areas conditioned to receiving metal, and non-selected areas to which metal will not adhere; the surface is then plasma sprayed with metal to coat the selectively prepared areas.

REFERENCES:
patent: 2599710 (1952-06-01), Hathaway
patent: 4263341 (1981-04-01), Martyniak
patent: 4424408 (1984-01-01), Elarde
patent: 4678738 (1987-07-01), Shimizu et al.
patent: 4921721 (1990-05-01), Matsui et al.
patent: 4940623 (1990-07-01), Bosna et al.
patent: 5391404 (1995-02-01), Lee et al.

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