Printed circuit board, process for preparing the same and resist

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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174 685, 427 98, 427259, 428901, H05K 318, C23C 1828

Patent

active

046109102

ABSTRACT:
A printed circuit board comprising an insulating board deposited with a catalyst having reactivity against electroless plating deposition, a resist for electroless plating provided on the insulating board excepting the part where a circuit is to be formed and a circuit formed by electroless plating, wherein the resist for electroless plating contains a coupling agent having a function of preventing the catalyst from ionizing. A process for producing the printed circuit board in which the insulating board surface excepting the part where a circuit is to be formed is covered with a resist for electroless plating containing a coupling agent having a function of preventing the catalyst from ionizing. Use of said resist for electroless plating can prevent drop of insulation resistance of the insulating board after moisture absorption.

REFERENCES:
patent: 3443988 (1969-05-01), McCormack
patent: 3799816 (1974-03-01), Schneble
patent: 4100037 (1978-07-01), Baron
patent: 4151313 (1979-04-01), Wajima
patent: 4293592 (1981-10-01), Morishita
patent: 4430154 (1984-02-01), Stahl
patent: 4486466 (1984-12-01), Leech
patent: 4537799 (1985-08-01), Dorey
Feldstein, "Selective Electroless Plating Techniques: A Survey" Plating, Aug. 1970.

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