Printed circuit board or card thermal mass design

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

174266, 361693, 361778, H05K 720

Patent

active

053632800

ABSTRACT:
A multi-layer printed circuit board or card including at least one passage in at least one of the layers of the circuit board or card for preventing the diffusion of heat throughout the circuit board or card during the securing or removal of components in plated through holes in the circuit board or card by the heating of the plating material to a temperature above a melting point of the plating material.

REFERENCES:
patent: 4628409 (1986-12-01), Thompson et al.
patent: 4729061 (1988-03-01), Brown
patent: 4792646 (1988-12-01), Enomoto
patent: 4845308 (1989-07-01), Womack, Jr.
patent: 4982311 (1991-01-01), Dehaine

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