Printed circuit board or card for direct chip attachment and fab

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361794, 361795, 174250, 174260, 174262, 174266, H05K 111

Patent

active

054186897

ABSTRACT:
A printed circuit board or card for direct chip attachment that includes at least one power core, at least one signal plane that is adjacent to the power core, and plated through holes for electrical connection is provided. In addition, a layer of dielectric material is adjacent the power core and a circuitized conductive layer is adjacent the dielectric material, followed by a layer of photosensitive dielectric material adjacent the conductive layer. Photodeveloped blind vias for subsequent connection to the power core and drilled blind vias for subsequent connection to the signal plane are provided. Also provided is process for fabricating the printed circuit board or card for direct chip attachment.

REFERENCES:
patent: 3436819 (1969-04-01), Lunine
patent: 4150421 (1979-04-01), Nishihara et al.
patent: 4572764 (1986-02-01), Fan
patent: 4642160 (1987-02-01), Burgess
patent: 4675789 (1987-06-01), Kuwabara et al.
patent: 4854038 (1989-08-01), Wiley
patent: 4864722 (1989-09-01), Lazzarini et al.
patent: 4935584 (1990-06-01), Boggs
patent: 5025555 (1991-06-01), Mase

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