Printed circuit board noise attenuation using lossy conductors

Wave transmission lines and networks – Transmission line inductive or radiation interference...

Reexamination Certificate

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C333S08100R, C361S818000

Reexamination Certificate

active

06873219

ABSTRACT:
A method and related configuration for attenuating high-frequency noise that may appear on power planes in printed circuit boards. In one embodiment, the noise attenuation means of the present invention involves applying a lower conductivity material between the conductive and dielectric layers within a printed circuit board. High-frequency noise is then attenuated by the skin effect. In another embodiment, the low conductivity material is applied between the power plane and dielectric layer within the printed circuit board. The low conductivity material may be a material, such as nickel or lead, having an electrical conductivity ranging between about 1×104mhos/m and 5.8×107mhos/m for layers having a thickness of about 2 mils.

REFERENCES:
patent: 6104258 (2000-08-01), Novak
patent: 6639155 (2003-10-01), Bupp et al.
patent: 6753481 (2004-06-01), Novak
patent: 0470031 (1992-02-01), None
patent: 11097810 (1999-04-01), None
J. Grebenkemper, “Thin PCB Laminates Used for power/ground plane pairs, they can reduce high-frequency noise on power distribution networks,” Printed Circuit Design Mar. 2002 (4 p.).
I. Novak, “Accuracy Considerations of Power-Ground Plane Models,” 8th Topical Meeting on Electrical Performance of Electronic Packaging, Oct. 25-27, 1999, San Diego, CA (4 p.).
B. Eged, “Analytical Calculation Of the Impedance of Lossy Power/Ground Planes,” IEEE Instrumentation and Measurement Technology Conference, Budapest, Hungary, May 21-23, 2001 (5 p.).
B. Beker et al., DesignCon 2002, High-Performance System Design Conference, TecForum HP-TF2, Thin PCB Laminates for Power Distribution How Thin is Thin Enough? (106 p.).
PCT Int'l Search Report, PCT/US2004/002434, Aug. 2, 2004 (Mailing Date).

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