Printed circuit board mounted with electric elements thereon

Details Printed circuit board mounted with electric elements thereon Printed circuit board mounted with electric elements thereon

1993-10-21

1995-03-21

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174257, 174261, 174263, 22818021, 22818022, 361760, 361763, 361767, 361768, 361772, 361779, H05K 710

Patent

active

054002214

ABSTRACT:
Electric elements such as a resistance chip, a capacitor chip, a semiconductor device package, and a connector are mounted on a printed circuit board by using at least two methods selected from the re-flow method using cream solder, the chip-on board method using bonding wires, the outer lead bonding method, and the thermal pressing method using heat-seal. The printed circuit board is provided with lands having surface layers of a non-electrolysis Ni--Au plate, a soft Au plate and an electrolysis solder plate, each corresponding to a selected mounting method.

REFERENCES:
patent: 4424409 (1984-01-01), Kuttner
patent: 4447857 (1984-05-01), Marks et al.
patent: 5144535 (1992-09-01), Megens et al.
patent: 5270903 (1993-12-01), McMichen et al.
Material A: "Multi-layer printed circuit board step 365" published by Kagyo-chosakai.
Material B: "Multi-chip mounting technology" published by K. K. Tricheps.

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