Metal working – Plural diverse manufacturing apparatus including means for... – Type of machine
Reexamination Certificate
2007-11-08
2011-10-18
Norris, Jeremy (Department: 2835)
Metal working
Plural diverse manufacturing apparatus including means for...
Type of machine
C029S02600B
Reexamination Certificate
active
08037584
ABSTRACT:
A printed circuit board, a method of manufacturing the printed circuit board, and an apparatus for perforating via holes are disclosed. By use of a method of manufacturing a printed circuit board that includes forming a first circuit pattern, which includes a reference mark and a via land, on one surface of an insulation substrate; stacking a metal layer on the insulation layer; opening a first window in the metal layer in correspondence with the reference mark; and forming a via which electrically connects the via land with the metal layer, by irradiating light towards the other surface of the insulation substrate and identifying the reference mark through the first window, the occurrence of short-circuiting is prevented in forming vias for electrical interconnection between circuit patterns in a printed circuit board, and as the defect rate caused by eccentricity between insulation layers may be reduced, aspects of the invention may contribute to reducing costs.
REFERENCES:
patent: 7220921 (2007-05-01), Sakamoto et al.
patent: 2006/0082958 (2006-04-01), Fujiwara
patent: 1281629 (2001-01-01), None
patent: 2634501 (2004-08-01), None
patent: 11-233950 (1999-08-01), None
patent: 2003-340587 (2003-12-01), None
patent: 2005-142190 (2005-06-01), None
patent: 2005-333050 (2005-12-01), None
patent: 3799091 (2006-04-01), None
patent: 2001-0060307 (2001-07-01), None
patent: 10-2006-0069756 (2006-06-01), None
Machine Translation of JP 1999-233950, Aug. 27, 1999.
English Translation of Korean Office Action for corresponding Korean Patent Application No. 10-2007-0039320 dated Feb. 21, 2008.
Chinese Office Action issued Oct. 18, 2010 in corresponding Chinese Patent Application 2007101513141.9.
Byun Dae-Jung
Jeong Jeong-Yeon
Park Kwang-Soo
Park Sim-Hwan
Norris Jeremy
Samsung Electro-Mechanics Co. Ltd.
LandOfFree
Printed circuit board, method of manufacturing the same, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed circuit board, method of manufacturing the same, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board, method of manufacturing the same, and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4273007