Printed circuit board, method of manufacturing a printed...

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit

Reexamination Certificate

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Details

C439S876000, C174S260000, C361S760000, C361S761000

Reexamination Certificate

active

07625222

ABSTRACT:
According to one embodiment, a printed circuit board includes a wiring board, a through-hole mount device, and a surface mount device. The wiring board has a first surface, a second surface opposite to the first surface, and through holes. The through-hole mount device has leads. The leads are soldered inside the through holes so that the through-hole mount device is mounted on the first surface. The leads have distal ends positioned inside the through holes. An adhesive fills the region between the wiring board and the through-hole mount device. The adhesive fixes the through-hole mount device to the first surface. A surface mount device is soldered to the second surface and closes the through holes in which the leads are inserted.

REFERENCES:
patent: 3991347 (1976-11-01), Hollyday
patent: 6165595 (2000-12-01), Kumagai et al.
patent: 7314378 (2008-01-01), Takizawa
patent: 2001/0023781 (2001-09-01), Muramatsu et al.
patent: 2001/0042640 (2001-11-01), Nakamura et al.
patent: 2002/0159243 (2002-10-01), Ogawa et al.
patent: 2004/0016567 (2004-01-01), Yamasaki et al.
patent: 2006/0216972 (2006-09-01), Modinger
patent: 10-41605 (1998-02-01), None
patent: 2004-63956 (2004-02-01), None
patent: 2004-200226 (2004-07-01), None

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