Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Reexamination Certificate
2008-01-01
2008-01-01
Ta, Tho D. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
C361S760000, C174S260000
Reexamination Certificate
active
07314378
ABSTRACT:
According to one embodiment, a printed circuit board has a wiring board having through holes, a through-hole mount device having a lead, and a surface mount device. The lead is soldered in the through hole, whereby the through-hole mount device is mounted on a first surface of the wiring board. The lead has a distal end lying in the through hole. The surface mount device is soldered to a second surface of the wiring board, closing the through hole in which the lead is inserted. The second surface is opposite to the first surface.
REFERENCES:
patent: 2001/0042640 (2001-11-01), Nakamura et al.
patent: 2002/0159243 (2002-10-01), Ogawa et al.
patent: 10-41605 (1998-02-01), None
patent: 2004-63956 (2004-02-01), None
patent: 2004-200226 (2004-07-01), None
Kabushiki Kaisha Toshiba
Knobbe Martens Olson & Bear LLP
Ta Tho D.
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