Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-04-19
2005-04-19
Cuneo, Kamand (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S766000, C174S260000, C428S209000
Reexamination Certificate
active
06882544
ABSTRACT:
A thin type printed circuit board with an enclosed capacitor of a large capacitance. The printed circuit board includes metal sheet11having roughed surface presenting micro-irregularities, a dielectric film for capacitor12covering the surface of the metal sheet, and a first electrically conductive layer of electrically conductive resin13covering the surface of the dielectric film. A second electrically conductive layer14is provided on the surface of the first electrically conductive layer in a region of via for cathode side connection18. The metal sheet and the first and second electrically conductive layers are encapsulated by resin15. The via for cathode side connection18, obtained on boring through the resin15until reaching the second electrically conductive layer14, is coated with an electrode20. A via for anode side connection19obtained on boring through the resin15is coated with an electrode21that is insulated from the second electrically conductive layer13by the resin15.
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patent: 6749927 (2004-06-01), Cooray
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Arai Satoshi
Nakamura Hirofumi
Cuneo Kamand
Dinh Tuan
McGinn & Gibb PLLC
NEC Tokin Corporation
NEC Toppan Circuit Solutions, Inc.
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