Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-01-21
1999-03-23
Sparks, Donald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174138G, 2781801, 361760, 361767, 361779, H05K 111
Patent
active
058868780
ABSTRACT:
The present application describes a through-hole component insulator and assembly process which has the advantages of preventing solder from contacting the metal case of a through-hole component without an addition step or additional material from the standard fabrication process for a printed circuit board. The printed circuit board of the present invention includes a printed ink spacer disposed beneath the through-hole component wherein the printed ink spacer is included with a standard silk-screen artwork layer in the printed circuit board design stage. The printed ink spacer raises the through-hole component from the printed circuit board surface to prevent solder from contacting the metal case of the through-hole component during the printed circuit board soldering stage. Using a silk-screen artwork layer which includes at least one printed ink spacer in the artwork, the printed ink spacer is deposited during deposition of a standard printed design on the printed circuit board fabrication.
REFERENCES:
patent: 4339785 (1982-07-01), Ohsawa
patent: 4573105 (1986-02-01), Beldavs
patent: 4833570 (1989-05-01), Teratani
patent: 5111991 (1992-05-01), Clawson et al.
patent: 5129573 (1992-07-01), Duffey
patent: 5155904 (1992-10-01), Majd
patent: 5489752 (1996-02-01), Cognetti et al.
patent: 5726861 (1998-03-01), Ostrem
Khadem Gita P.
Slupek Darrell J.
Dell USA L.P.
Sparks Donald
Terrile Stephen A.
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