Printed circuit board manufacturing method and printed...

Details Printed circuit board manufacturing method and printed... Printed circuit board manufacturing method and printed...

2007-09-27

2010-11-16

Patel, Ishwarbhai B (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S264000

Reexamination Certificate

active

07834277

ABSTRACT:
The present invention provides a method of manufacturing printed a circuit board capable of formation of via holes having a low aspect ratio and formation of fine lines, and a printed circuit board manufactured by the method. The method of manufacturing a printed circuit board10according to the present invention includes a step of selectively forming a plating layer16for lands22aand22bon a metal foil14on the printed circuit board10, a step of adjusting the thickness of the plating layer16, and a step of forming the metal foil14into lines14a. The aspect ratio of via holes28formed on lands22aand22bcan be adjusted by adjusting the thickness of the lands22aand22b.

REFERENCES:
patent: 4104111 (1978-08-01), Mack
patent: 5160579 (1992-11-01), Larson
patent: 5680701 (1997-10-01), Sippel
patent: 6323439 (2001-11-01), Kambe et al.
patent: 6591495 (2003-07-01), Hirose et al.
patent: 6717070 (2004-04-01), Watanabe
patent: 6828510 (2004-12-01), Asai et al.
patent: 7514637 (2009-04-01), En
patent: 7535095 (2009-05-01), En et al.
patent: 50-41056 (1975-04-01), None
patent: 01-129494 (1989-05-01), None
patent: 03-175695 (1991-07-01), None
patent: 04-062892 (1992-02-01), None
Office Action of U.S. Appl. No. 10/709,752 dated Feb. 27, 2009.

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