Printed circuit board manufacturing method accommodates wave sol

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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29837, 29840, 174261, 174262, 174263, 2281801, 439 55, 361748, 361767, 361807, 361808, H05K 330, H05K 332, H05K 334, H05K 710

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052709035

ABSTRACT:
A first set of plated-through holes in the printed circuit board (PCB) are covered by a protective solder mask on the solder side of the PCB while a second set of plated-through holes are exposed. Electrical components are disposed on the component side with leads inserted in the second set of holes. Solder is prevented from flowing into the first set of holes during wave soldering by the mask covering. Conductive pins designed for press fitting into the first set of holes are inserted therethrough to define connecting pins on each side of the PCB following wave soldering. This permits both a wave soldering and press fit operation to be accommodated.

REFERENCES:
patent: 3528173 (1970-09-01), Gall
patent: 3745513 (1973-07-01), Gross
patent: 4086426 (1978-04-01), Knappenberger
patent: 4185378 (1980-01-01), Machida
patent: 4295184 (1981-10-01), Roberts
patent: 4373259 (1983-02-01), Motsch
patent: 4739919 (1988-04-01), Van Den Brekel et al.
patent: 4970624 (1990-11-01), Arneson et al.
patent: 4982376 (1991-01-01), Megens et al.
IBM Technical Disclosure Bulletin "Circuit Board Connective Scheme" by Roche et al. vol. 6 No. 8 Jan. 1964.
Western Electric "Attaching Leads To Flexible Substrates" by A. F. Glaubke Tech. Digest No. 52 Oct. 1978.

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