Printed circuit board manufacturing method

Details Printed circuit board manufacturing method Printed circuit board manufacturing method

2008-11-19

2011-12-20

Banks, Derris (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S831000, C029S840000, C029S842000, C029S846000, C174S260000, C361S767000

Reexamination Certificate

active

08079142

ABSTRACT:
A method for manufacturing a printed circuit board, including providing a core substrate and an electronic component contained in the core substrate, the electronic component having a die pad, forming a positioning mark on the core substrate, forming an interlayer insulating layer over the core substrate and the electronic component, forming a via hole opening connecting to the die pad of the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate, and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the die pad.

REFERENCES:
patent: 3495324 (1970-02-01), Guthrie et al.
patent: 3775844 (1973-12-01), Parks
patent: 3903590 (1975-09-01), Yokogawa
patent: 4372996 (1983-02-01), Guditz et al.
patent: 4751146 (1988-06-01), Maeda et al.
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4835704 (1989-05-01), Eichelberger et al.
patent: 4894115 (1990-01-01), Eichelberger et al.
patent: 5042145 (1991-08-01), Boucquest
patent: 5073814 (1991-12-01), Cole et al.
patent: 5081563 (1992-01-01), Feng et al.
patent: 5108950 (1992-04-01), Wakabayashi et al.
patent: 5111278 (1992-05-01), Eichelberger
patent: 5126016 (1992-06-01), Glenning et al.
patent: 5130889 (1992-07-01), Hamburgen et al.
patent: 5161093 (1992-11-01), Gorczyca et al.
patent: 5250843 (1993-10-01), Eichelberger
patent: 5289631 (1994-03-01), Koopman et al.
patent: 5297006 (1994-03-01), Mizukoshi
patent: 5304511 (1994-04-01), Sakai
patent: 5309322 (1994-05-01), Wagner et al.
patent: 5318923 (1994-06-01), Park
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5386623 (1995-02-01), Okamoto et al.
patent: 5410184 (1995-04-01), Melton et al.
patent: 5434751 (1995-07-01), Cole et al.
patent: 5455459 (1995-10-01), Fillion et al.
patent: 5521122 (1996-05-01), Kuramochi
patent: 5524339 (1996-06-01), Gorowitz et al.
patent: 5527741 (1996-06-01), Cole et al.
patent: 5563449 (1996-10-01), Dion et al.
patent: 5596227 (1997-01-01), Saito
patent: 5629564 (1997-05-01), Nye, III et al.
patent: 5700716 (1997-12-01), Sharan et al.
patent: 5713127 (1998-02-01), Chobot et al.
patent: 5745984 (1998-05-01), Cole et al.
patent: 5757072 (1998-05-01), Gorowitz et al.
patent: 5773899 (1998-06-01), Zambrano
patent: 5829125 (1998-11-01), Fujimoto et al.
patent: 5841193 (1998-11-01), Eichelberger
patent: 5879568 (1999-03-01), Urasaki et al.
patent: 5887343 (1999-03-01), Salatino et al.
patent: 5920123 (1999-07-01), Moden
patent: 5937320 (1999-08-01), Andricacos et al.
patent: 5940688 (1999-08-01), Higuchi et al.
patent: 5943597 (1999-08-01), Kleffner et al.
patent: 5969424 (1999-10-01), Matsuki et al.
patent: 5972736 (1999-10-01), Malladi et al.
patent: 5985377 (1999-11-01), Corbett
patent: 5998859 (1999-12-01), Griswold et al.
patent: 6025995 (2000-02-01), Marcinkiewicz
patent: 6110806 (2000-08-01), Pogge
patent: 6111321 (2000-08-01), Agarwala
patent: 6153829 (2000-11-01), Carapella et al.
patent: 6154366 (2000-11-01), Ma et al.
patent: 6162652 (2000-12-01), Dass et al.
patent: 6232212 (2001-05-01), Degani et al.
patent: 6232558 (2001-05-01), Tsukada et al.
patent: 6235453 (2001-05-01), You et al.
patent: 6248428 (2001-06-01), Asai et al.
patent: 6256875 (2001-07-01), Watanabe et al.
patent: 6271469 (2001-08-01), Ma et al.
patent: 6281046 (2001-08-01), Lam
patent: 6292366 (2001-09-01), Platt
patent: 6294741 (2001-09-01), Cole et al.
patent: 6317948 (2001-11-01), Kola et al.
patent: 6324067 (2001-11-01), Nishiyama
patent: 6327158 (2001-12-01), Kelkar et al.
patent: 6330259 (2001-12-01), Dahm
patent: 6337228 (2002-01-01), Juskey et al.
patent: 6339197 (2002-01-01), Fushie et al.
patent: 6365833 (2002-04-01), Eng et al.
patent: 6370013 (2002-04-01), Iino et al.
patent: 6395073 (2002-05-01), Dauber
patent: 6433360 (2002-08-01), Dosdos et al.
patent: 6586276 (2003-07-01), Towle et al.
patent: 6627997 (2003-09-01), Eguchi et al.
patent: 6657707 (2003-12-01), Morken et al.
patent: 6667230 (2003-12-01), Chen et al.
patent: 6750135 (2004-06-01), Elenius et al.
patent: 6756295 (2004-06-01), Lin et al.
patent: 6782897 (2004-08-01), Wang et al.
patent: 7008867 (2006-03-01), Lei
patent: 7189596 (2007-03-01), Mu et al.
patent: 7405149 (2008-07-01), Lin et al.
patent: 2002/0000239 (2002-01-01), Sachdev et al.
patent: 2003/0014863 (2003-01-01), Lee et al.
patent: 2003/0134233 (2003-07-01), Su et al.
patent: 2004/0166661 (2004-08-01), Lei
patent: 2004/0222522 (2004-11-01), Homma
patent: 2005/0014355 (2005-01-01), Chan et al.
patent: 2008/0148563 (2008-06-01), Sakamoto et al.
patent: 0 465 138 (1992-01-01), None
patent: 0 471 938 (1992-02-01), None
patent: 0 777 274 (1997-06-01), None
patent: 0 884 128 (1998-12-01), None
patent: 1 003 209 (2000-05-01), None
patent: 1 024 531 (2000-08-01), None
patent: 1 032 030 (2000-08-01), None
patent: 1 039 789 (2000-09-01), None
patent: 1 259 103 (2002-11-01), None
patent: 2-58345 (1990-02-01), None
patent: 02-312296 (1990-12-01), None
patent: 3-24786 (1991-02-01), None
patent: 03-038084 (1991-02-01), None
patent: 3-50734 (1991-03-01), None
patent: 03-77327 (1991-04-01), None
patent: 03-101234 (1991-04-01), None
patent: 4-25038 (1992-01-01), None
patent: 04-065832 (1992-03-01), None
patent: 4-72656 (1992-03-01), None
patent: 4-154197 (1992-05-01), None
patent: 05-046069 (1993-06-01), None
patent: 5-160588 (1993-06-01), None
patent: 05-275856 (1993-10-01), None
patent: 06-268098 (1994-09-01), None
patent: 06-268101 (1994-09-01), None
patent: 06-350020 (1994-12-01), None
patent: 07-058276 (1995-03-01), None
patent: 8-78572 (1996-03-01), None
patent: 8-255855 (1996-10-01), None
patent: 8-330313 (1996-12-01), None
patent: 9-278494 (1997-10-01), None
patent: 09-321408 (1997-12-01), None
patent: 10-098081 (1998-04-01), None
patent: 10-189635 (1998-07-01), None
patent: 10-199886 (1998-07-01), None
patent: 10-256429 (1998-09-01), None
patent: 10-256737 (1998-09-01), None
patent: 10-284632 (1998-10-01), None
patent: 10-321634 (1998-12-01), None
patent: 11-54939 (1999-02-01), None
patent: 11-103166 (1999-04-01), None
patent: 11-111738 (1999-04-01), None
patent: 11-126978 (1999-05-01), None
patent: 11-145174 (1999-05-01), None
patent: 11-163213 (1999-06-01), None
patent: 11-176977 (1999-07-01), None
patent: 11-220262 (1999-08-01), None
patent: 11-233678 (1999-08-01), None
patent: 11-251754 (1999-09-01), None
patent: 11-274734 (1999-10-01), None
patent: 2000-21916 (2000-01-01), None
patent: 2000-150705 (2000-05-01), None
patent: 2000-243754 (2000-09-01), None
patent: 2000-260902 (2000-09-01), None
patent: 2000-323645 (2000-11-01), None
patent: 121735 (1997-11-01), None
patent: 1999-2341 (1999-01-01), None
patent: 99/30542 (1999-06-01), None
patent: 00/63970 (2000-10-01), None
U.S. Appl. No. 12/274,162, filed Nov. 19, 2008, Sakamoto et al.

Affiliated with

Also associated with

Rating

Printed circuit board manufacturing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circuit board manufacturing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board manufacturing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4259763