Printed circuit board manufacture

Details Printed circuit board manufacture Printed circuit board manufacture

2005-03-01

2005-03-01

Klemanski, Helene (Department: 1755)

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

C106S001230, C106S001240, C106S001250, C106S001260, C106S001270, C106S001280

Reexamination Certificate

active

06860925

ABSTRACT:
A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.

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