Printed circuit board, magnetic disk device, and method for...

Details Printed circuit board, magnetic disk device, and method for... Printed circuit board, magnetic disk device, and method for...

2008-07-22

2008-07-22

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S254000, C360S323000

Reexamination Certificate

active

07402759

ABSTRACT:
An insulating substrate includes a first area where a semiconductor device is disposed, a second area where a wiring electrically connecting to the semiconductor device is disposed, and a third area where a terminal electrically connecting to the wiring is disposed. A first wiring is disposed on a main surface of the insulating substrate in the second area and connects to the second wiring disposed in the first area and the terminal disposed in the third area through first and second interlayer connecting portions. With this configuration, the second wiring need not be disposed in the second area, so that flexibility in the second area used as a connecting portion increases.

REFERENCES:
patent: 5800650 (1998-09-01), Anderson et al.
patent: 6650519 (2003-11-01), Karr et al.
patent: 6687097 (2004-02-01), Anderson et al.
patent: 6717068 (2004-04-01), Motonishi et al.
patent: 2001/0030836 (2001-10-01), Katsumata
patent: 2002/0140076 (2002-10-01), Yamazaki et al.
patent: 2004/0088416 (2004-05-01), Nakatani et al.
patent: 6-028828 (1994-02-01), None
patent: 2003-124579 (2003-04-01), None

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