Printed circuit board laminating machine

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Chamber enclosing work during bonding and/or assembly

Patent

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Details

100269A, 1565833, B32B 3104, B32B 3120

Patent

active

048061956

ABSTRACT:
There is shown and described a relatively simple method and apparatus for laminating dry films onto printed circuit boards. The apparatus is a relatively low-cost device which uses vacuum or atmospheric pressure and temperature for performing a laminating operation and is especially adapted for use in custom printed circuit board fabrication techniques.

REFERENCES:
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patent: 2662960 (1953-12-01), Williams
patent: 2945976 (1960-07-01), Fridrich et al.
patent: 3190215 (1965-06-01), Howard et al.
patent: 3818823 (1974-06-01), Bond
patent: 4127436 (1978-11-01), Friel
patent: 4447282 (1984-05-01), Valerio et al.
patent: 4700474 (1987-10-01), Choinski

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