Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1992-04-03
1993-06-15
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 65, H01R 909
Patent
active
052192920
ABSTRACT:
A printed circuit substrate interconnection is made between two printed circuit substrates. A first printed circuit substrate (10) is a laminate of at least two dielectric layers (12, 14), and has a first circuit pattern (16) disposed between the two layers. The circuit pattern terminates in one or more lands or pads (17) located near a vertical edge (13) of the layer. The second dielectric layer is laminated to the first layer, over the circuit pattern, so as to reveal the lands. A second printed circuit substrate (20) is a laminate of at least one dielectric layer (22), and has a second circuit pattern (26) terminating in one or more lands or pads (27) located near a vertical edge (23) of the layer, and in a pattern corresponding to the lands of the first circuit pattern. The first printed circuit substrated (10) is coupled to the second printed circuit substrate (20) so as to co-operatively mate the two printed circuit substrates, forming an electrical interconnection between the first circuit pattern lands (17) and the second circuit pattern lands (27).
REFERENCES:
patent: 3214725 (1965-10-01), de Rose et al.
patent: 3221286 (1965-11-01), Fedde
patent: 3772776 (1973-11-01), Weisenburger
patent: 4116516 (1978-09-01), Griffin
patent: 4411633 (1983-10-01), Waldron
patent: 4513064 (1985-04-01), Marcus
Dickirson David M.
Digiacomo, Jr. Ralph E.
Abrams Neil
Dorinski Dale W.
Motorola Inc.
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