Printed circuit board including via contributing to superior...

Details Printed circuit board including via contributing to superior... Printed circuit board including via contributing to superior...

2008-05-13

2008-05-13

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S701000, C257S759000, C257S774000, C257S786000, C174S262000, C361S777000, C361S803000

Reexamination Certificate

active

11151198

ABSTRACT:
A via is formed in a printed circuit board to penetrate through an insulating layer. A guard pattern, made of an electrically-conductive material, extends on the front surface of the insulating layer along a circle concentric with the via. An electrically-conductive body extends from the guard pattern in the insulating layer along an imaginary cylinder concentric with the via. The guard pattern of the printed circuit board serves to control the characteristic impedance of the via at the front surface of the insulating layer. The electrically-conductive body contributes to a better control of the characteristic impedance of the via. The via is allowed to reliably enjoy a better impedance matching than ever. Noise can sufficiently be suppressed in electric signals running through the via.

REFERENCES:
patent: 5736679 (1998-04-01), Kresge et al.
patent: 7091424 (2006-08-01), Oggioni et al.
patent: 01-168093 (1989-07-01), None
patent: 5-206678 (1993-08-01), None
patent: 06-037412 (1994-02-01), None
patent: 7-240584 (1995-09-01), None
patent: 11-112156 (1999-04-01), None
patent: 2000-216513 (2000-08-01), None
patent: 2000-261150 (2000-09-01), None
patent: 2001-223449 (2001-08-01), None
patent: 2001-284802 (2001-10-01), None
Japanese Office Action, mailed on Sep. 26, 2006, in a corresponding Japanese Patent Application.

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