Printed circuit board including pads with vacancies

Details Printed circuit board including pads with vacancies Printed circuit board including pads with vacancies

2007-07-03

2007-07-03

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000

Reexamination Certificate

active

11188481

ABSTRACT:
Methods and apparatuses for affecting the frequency behavior of connections within a printed circuit board or an integrated circuit are disclosed. Some embodiments include a printed circuit board comprising, a plurality of conductive layers each comprising at least one conductive pad, where each conductive pad on the conductive layers includes a vacancy, and an insulating material disposed about the conductive layers such that the vacancies are at least partially filled with the insulating material.

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patent: 6762368 (2004-07-01), Saputro et al.
patent: 7084354 (2006-08-01), Boggs et al.
patent: 0200401455 (2004-01-01), None
D. Buysse, “Terminal blocks: Through-hole reflow technology makes the grade,” Oct. 2004, 4 pp. [Online] http://connectorspecifier.printthis.clickability.com/pt/cpt?action=cpt&title=Terminal+bloc... .
L. Ritchey, “Anatomy of a Plated Through Hole,” Aug. 30, 2001, 5 pp.

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