Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2007-10-16
2007-10-16
Brewster, William M. (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S124000, C438S125000, C257SE23131
Reexamination Certificate
active
11179864
ABSTRACT:
A method of fabricating a printed circuit board (PCB) including embedded chips, composed of forming a hollow portion for chip insertion through a substrate, inserting the chip into the hollow portion, fixing the chip to the substrate by use of a plating process to form a central layer having an embedded chip, and then laminating a non-cured resin layer and a circuit layer having a circuit pattern on the central layer. Also, a PCB including embedded chips fabricated using the above method is provided.
REFERENCES:
patent: 4729061 (1988-03-01), Brown
patent: 5592737 (1997-01-01), Middelman et al.
patent: 6606793 (2003-08-01), Dunn
patent: 2004/0014317 (2004-01-01), Sakamoto et al.
patent: 2004/0168825 (2004-09-01), Sakamoto et al.
patent: 2004-7006 (2004-01-01), None
patent: 2004-153084 (2004-05-01), None
patent: WO-01/19148 (2001-03-01), None
Patent Abstracts of Japan for 2004-007006 published on Jan. 8, 2004.
Patent Abstracts of Japan for 2004-153084 published on May 27, 2004.
Cho Suk Hyeon
Lee Doo Hwan
LandOfFree
Printed circuit board including embedded chips and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed circuit board including embedded chips and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board including embedded chips and method of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3838740