Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-12-13
2005-12-13
Vu, Phuong T. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S760000, C361S787000, C361S803000, C029S832000
Reexamination Certificate
active
06975518
ABSTRACT:
An electronic assembly includes one or more conductive clamps (302, 304, FIG.3), which are used to supply current to an integrated circuit (IC) package (308). The conductive clamps are attached to a printed circuit (PC) board (312), which supplies the current to the IC package over one clamp, and receives returned current from the IC package over another clamp. Each clamp contacts a contact pad (330) on the surface of the PC board, and contacts another contact pad (334) on the top surface of the IC package. Vias (338, 339) and conductive planes (340, 342) within the package then carry current to and from an IC (e.g., IC306) connected to the package. In another embodiment, the clamp (904, FIG.9) holds a conductive structure (902) in place between the PC board contact pad (908) and the IC package contact pad (914), and current is carried primarily over the conductive structure, rather than over the clamp.
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Frutschy Kristopher
Reid Geoffrey L.
Stewart Glenn E.
Yahyaei-Moayyed Farzaneh
Schwegman Lundberg Woessner & Kluth P.A.
Vu Phuong T.
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