Printed circuit board holding structure

Details Printed circuit board holding structure Printed circuit board holding structure

2002-01-28

2004-10-26

Martin, David (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S801000

Reexamination Certificate

active

06809933

ABSTRACT:

TECHNICAL FIELD
The present invention relates to a printed circuit board holding structure for attaching a printed circuit board (PCB, hereinafter) into a housing, and more particularly to a PCB holding structure capable of reducing a thickness of the housing.
BACKGROUND ART
Conventionally, there has been a PCB holding structure for attaching a PCB into a housing as shown in
FIGS. 4 and 5
. The PCB holding structure serves to attach a sub-PCB to a chassis provided in a casing of a mobile telephone. Description will be given below with reference to
FIGS. 4 and 5
.
As shown in
FIG. 4
, the mobile telephone comprises a first casing
21
and a second casing
22
. The first casing
21
is provided on the back side and accommodates a chassis
25
, a main PCB
24
held on the lower side of the chassis
25
, a sub-PCB
26
held on the upper side of the chassis
25
, and an LCD module
27
held on the upper side of the chassis
25
.
The second casing
22
is provided on the surface side to cover the upper surface of the first casing
21
and has an opening formed in a position opposed to the LCD module
27
. A transparent window
23
is fixed over the opening. In the following description, an upward direction during the use of the mobile telephone is set to a forward direction of the casing.
On both side ends in a place of the chassis
25
where the sub-PCB
26
is to be attached, a pair of movable clicks
28
and
29
are provided in a longitudinal direction with a predetermined space, respectively. In the movable clicks
28
and
29
, taper faces formed on upper ends are opposed to taper faces of the movable clicks
28
and
29
provided on opposite side ends. Moreover, the space between the opposed taper faces is set to be slightly smaller than a lateral width of the sub-PCB
26
and elastic deformation can be carried out in such a direction that the space is increased.
When attaching the sub-PCB
26
onto the chassis
25
, the taper faces of the movable clicks
28
and
29
are pressed downward from the lower surfaces in both side edge portions of the sub-PCB
26
as shown in FIG.
5
A. The movable clicks
28
and
29
are pressed against the sub-PCB
26
and are thereby deformed elastically in such a direction that the lateral space is increased, and are then returned to an original state after the sub-PCB
26
is mounted on the upper surface of the chassis
25
. Thus, the sub-PCB
26
can be held by the movable clicks
28
and
29
.
In, the conventional PCB holding structure described above, the sub-PCB
26
is guided and held through the movable clicks
28
and
29
. As shown in
FIG. 5B
, therefore, it is necessary to have a holding width a in addition to a guide width b for guiding the sub-PCB
26
to a predetermined board position. In other words, a width of (a+b) is required for the taper fate and a height of (d
1
+d
2
) is required for the taper face. As a result, the taper face of the movable click is increased upward. Consequently, there has been a problem in that a vertical thickness of the casing is increased.
In order to solve such a problem, the invention has an object to provide a PCB holding structure capable of reducing a thickness of a casing.
DISCLOSURE OF INVENTION
The present invention provides a PCB holding structure wherein a first guide member having a taper face for guiding a PCB in a transverse direction when fixedly putting the PCB on an attachment object member and a second guide member having at a taper face for downward guiding the PCB put fixedly when sliding the PCB in a longitudinal direction are provided on the attachment object member. By such a structure, it is possible to set the heights of the first and second guide members to be smaller than a height of a conventional click. Therefore, it is possible to reduce a thickness of an apparatus casing having the PCB provided therein.


REFERENCES:
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patent: 5144533 (1992-09-01), Annett
patent: 5154631 (1992-10-01), Belanger, Jr.
patent: 5229923 (1993-07-01), Long et al.
patent: 5415573 (1995-05-01), Chen et al.
patent: 5581446 (1996-12-01), Sanpei et al.
patent: 5689405 (1997-11-01), Bethurum
patent: 5704489 (1998-01-01), Smith
patent: 5755585 (1998-05-01), Cheng et al.
patent: 5961338 (1999-10-01), Wu et al.
patent: 6324076 (2001-11-01), Gerrits et al.
patent: 2001/0005655 (2001-06-01), Cabane et al.
patent: 75 26 707 (1975-12-01), None
patent: 2803110 (2001-06-01), None

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