Printed circuit board having U-shaped solder mask layer separati

Details Printed circuit board having U-shaped solder mask layer separati Printed circuit board having U-shaped solder mask layer separati

1993-02-16

1995-01-31

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361767, 174250, H05K 109

Patent

active

053860870

ABSTRACT:
A circuit pattern layer is formed over the surface of a laminated board such that it includes one array of solder pads. The circuit pattern layer has its surface covered with a solder mask layer. The solder mask layer has a U-shaped recess at the area of the solder pad. The solder pad is exposed at the area of the U-shaped recess. Upon the soldering of the connector's connection terminal to the solder pad at the area of the U-shaped recess, a molten solder is kept in the U-shaped recess and prevented from flowing onto the adjacent connection terminal. It is thus possible to prevent a solder bridge from being created across those connection terminals.

REFERENCES:
patent: 4132341 (1979-01-01), Bratschun
patent: 4295183 (1981-10-01), Miersch et al.
patent: 4755631 (1988-07-01), Churchwell et al.
patent: 4767892 (1988-08-01), Koban
patent: 4893216 (1990-01-01), Hagner
patent: 4965702 (1990-10-01), Lott et al.
patent: 5266748 (1993-11-01), Kawakami et al.
Patent Abstracts of Japan, vol. 16, No. 27 (E-1158) 23 Jan. 1992 & JP-A-32 41 888 (Toshiba Corp) 29 Oct. 1991 *Abstract*.
Patent Abstracts of Japan, vol. 13, No. 176 (E-749) Apr. 1989 & JP-A-10 05 096 (Brother Ind Ltd) 10 Jan. 1989 *Abstract*.

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