Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-02-03
1995-03-28
Ledynh, Bot
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361761, 174260, 174262, 174263, 174266, H05K 702
Patent
active
054023149
ABSTRACT:
A printed circuit board having a through-hole in a land is disclosed. A solder resist of a photo-curable solder resist is formed on the substrate surface of the printed circuit board and the through-hole is stopped with the same photo-curable solder resist as the solder resist layer. If a land on which a chip component is mounted co-exists with a land on which a discrete component is mounted, only the through-hole in the land on which the chip component is mounted is selectively stopped with the photo-curable solder resist. The solder resist layer and the photo-curable solder resist stopping the through-hole are formed by selective light exposure from both the front and reverse surfaces of the substrate.
REFERENCES:
patent: 4230793 (1980-10-01), Losert et al.
patent: 4884337 (1989-12-01), Choinski
Amago Hirohisa
Ishii Seimi
Komatsu Nobuo
Yasuda Nobuyuki
Kananen Ronald P.
Ledynh Bot
Sony Corporation
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