Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2009-05-07
2011-11-29
Dinh, Tuan T (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S763000, C361S765000, C361S794000, C361S795000
Reexamination Certificate
active
08068347
ABSTRACT:
Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.
REFERENCES:
patent: 6714422 (2004-03-01), Ogawa et al.
patent: 7004984 (2006-02-01), Fukuta et al.
Choi Don Chul
Ju Jae Cheol
Lee Dong Hwan
Park Sang Soo
Yoon Hee Soo
Dinh Tuan T
Gottlieb Rackman & Reisman P.C.
Samsung Electro-Mechanics Co. Ltd
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